CoolGM ®  GGT series thermal conductive silicon gel is a two-component flexible silica gel with low stress, high thermal conductivity and other characteristics. The product is commonly used to fill the gaps between heating components, eliminate assembly tolerances after curing, and effectively reduce stress damage to components due to automatic adhesive assembly and vulcanization molding. The cured thermal conductive adhesive has similar performance to the thermal conductive gasket, with excellent high temperature resistance and aging resistance, and can work for a long time at -40~200 ℃.

Product features and advantages:

Thermal conductivity coefficient 1.0-3.0W/(m · K)

Low compression force application, adjustable curing time

Low viscosity and easy to apply glue

Excellent temperature and chemical stability performance

Excellent electrical insulation

Typical applications:

Packaging of power module

Protection and packaging of electronic components and assemblies

Network communication equipment, calculator cooling module

Memory modules, power semiconductors

Between new energy vehicles, battery packs, and liquid cooled plates

Product specifications:

Barrel: 20KG (packaged separately with AB glue) can be customized according to customer requirements

Product Physical Property Table